Electronic component sourcing & distribution since 2004 richard@fastspeed-ic.com ↗
中文 Upload BOM Request quote
Infineon / HEXFET Power MOSFETs

IRFB3206PBF

Infineon IRFB3206PBF (HEXFET power MOSFET) is designed for high-voltage, high-current applications such as motor drives, power conversion and power amplification. Genuine original stock; Rds(on), Vceo and package thermal performance are per the official Datasheet. Contact us for pricing, samples and available stock.

New & Original Prototype to volume sourcing
COMPONENT PROFILE
Infineon IRFB3206PBF
Image for reference
Package
TO-220

Product overview

Infineon IRFB3206PBF (HEXFET power MOSFET) is designed for high-voltage, high-current applications such as motor drives, power conversion and power amplification. Genuine original stock; Rds(on), Vceo and package thermal performance are per the official Datasheet. Contact us for pricing, samples and available stock.

Manufacturer
Infineon
Part number
IRFB3206PBF
Category
HEXFET Power MOSFETs
Package
TO-220
Packaging
Tube
Condition
New & Original
Compliance
RoHS Compliant
Lifecycle
Confirm with manufacturer
Lead time / MOQ
Confirm with quotation

Technical parameters

34 parameters

Construction

PD @TC = 25°C Maximum Power Dissipation
300 W
Linear Derating Factor
2.0 W/°C
dv/dt Peak Diode Recovery f
5.0 V/ns
10lb in (
1.1N m)
EAS (Thermally limited) Single Pulse Avalanche Energy e
170 mJ
RθJC Junction-to-Case k
0.50
RθCS Case-to-Sink, Flat Greased Surface
0.50
RθJA Junction-to-Ambient, TO-220 k
62
RθJA Junction-to-Ambient (PCB Mount) , D2 Pak jk
40
gfs Forward Transconductance
210
Qg Total Gate Charge
12
Qgs Gate-to-Source Charge
2
Qgd Gate-to-Drain ("Miller") Charge
3 VGS=10Vg
Qsync Total Gate Charge Sync. (Qg - Qgd)
8
td(on) Turn-On Delay Time
1
tr Rise Time
8
td(off) Turn-Off Delay Time
5
tf Fall Time
8
Ciss Input Capacitance
654
Coss Output Capacitance
72
Crss Reverse Transfer Capacitance
36
trr Reverse Recovery Time
3
Qrr Reverse Recovery Charge
4

Performance

IDM Pulsed Drain Current d
840
VGS Gate-to-Source Voltage
± 20 V
Soldering Temperature, for 10 seconds
300
IAR Avalanche Current d See Fig. 14, 1
5, 22a, 22b, A
V(BR)DSS Drain-to-Source Breakdown Voltage
60
ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient
0
RDS(on) Static Drain-to-Source On-Resistance
2
VGS(th) Gate Threshold Voltage
2.0
RG Internal Gate Resistance
0 –––Ω
IS Continuous Source Current
210
IRRM Reverse Recovery Current
2

Specifications & documentation

Use the official manufacturer documentation to verify electrical characteristics, package dimensions and operating limits before design approval.

Request confirmation of current stock, date code, packaging, price and delivery terms. Product information does not constitute a binding offer; final specifications are confirmed with your quotation.