Electronic component sourcing & distribution since 2004 richard@fastspeed-ic.com ↗
中文 Upload BOM Request quote
Infineon / HEXFET Power MOSFETs

IRF3710LPBF

Infineon IRF3710LPBF (HEXFET power MOSFET) is designed for high-voltage, high-current applications such as motor drives, power conversion and power amplification. Genuine original stock; Rds(on), Vceo and package thermal performance are per the official Datasheet. Contact us for pricing, samples and available stock.

New & Original Prototype to volume sourcing
COMPONENT PROFILE
TO-220 generic package illustration, not a part-specific image

Isometric preview; switch to top or 3D.

TO-220 · Generic package illustration

Based on the catalogue package field; not verified for this part. Check manufacturer documentation for dimensions, polarity and pinout.View part documentation ↓
Package reference · Not a dimension drawing
Package
TO-220

Product overview

Infineon IRF3710LPBF (HEXFET power MOSFET) is designed for high-voltage, high-current applications such as motor drives, power conversion and power amplification. Genuine original stock; Rds(on), Vceo and package thermal performance are per the official Datasheet. Contact us for pricing, samples and available stock.

Manufacturer
Infineon
Part number
IRF3710LPBF
Category
HEXFET Power MOSFETs
Package
TO-220
Packaging
Tube
Condition
New & Original
Lifecycle
Confirm with manufacturer
Lead time / MOQ
Confirm with quotation

Technical parameters

38 parameters

Construction

PD @TC = 25°C Maximum Power Dissipation
200 W
Linear Derating Factor
1.3 W/°C
EAR Repetitive Avalanche Energy 
20 mJ
dv/dt Peak Diode Recovery dv/dt
5.8 V/ns
RJC Junction-to-Case
0.75
RCS Case-to-Sink, Flat, Greased Surface
0.50 °C/W
RJA Junction-to-Ambient
62
gfs Forward Trans conductance
32
Gate-to-Source Forward Leakage
100 VGS=20V
Gate-to-Source Reverse Leakage
100 VGS=-20V
Qg Total Gate Charge
130 ID=28A
Qgs Gate-to-Source Charge
26
Qgd Gate-to-Drain Charge
43
td(on) Turn-On Delay Time
12 VDD=50V
tr Rise Time
58 ID=28A
td(off) Turn-Off Delay Time
45 RG=2.5
tf Fall Time
47
LD Internal Drain Inductance
4.5
LS Internal Source Inductance
7.5
Ciss Input Capacitance
3130 VGS=0V
Coss Output Capacitance
410
Crss Reverse Transfer Capacitance
72
EAS Single Pulse Avalanche Energy 
060
IS
57
ISM
230
trr Reverse Recovery Time
140
Qrr Reverse Recovery Charge
670

Performance

ID @ TC = 25°C Continuous Drain Current, VGS @ 10V
57
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
40 A
IDM Pulsed Drain Current 
180
VGS Gate-to-Source Voltage
± 20 V
IAR Avalanche Current
28 A
Soldering Temperature, for 10 seconds (1.6mm from case)
300
V(BR)DSS Drain-to-Source Breakdown Voltage
100
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient
0.13
RDS(on) Static Drain-to-Source On-Resistance
23
VGS(th) Gate Threshold Voltage
4.0
VSD Diode Forward Voltage
1.2

Specifications & documentation

Use the official manufacturer documentation to verify electrical characteristics, package dimensions and operating limits before design approval.

Request confirmation of current stock, date code, packaging, price and delivery terms. Product information does not constitute a binding offer; final specifications are confirmed with your quotation.