LND25N50W
Longteng LND25N50W (high-voltage MOSFET) is designed for high-voltage, high-current applications such as motor drives, power conversion and power amplification. Genuine original stock; Rds(on), Vceo and package thermal performance are per the official Datasheet. Contact us for pricing, samples and available stock.
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TO-220 · Generic package illustration
Based on the catalogue package field; not verified for this part. Check manufacturer documentation for dimensions, polarity and pinout.View part documentation ↓- Package
- TO-220F
Product overview
Longteng LND25N50W (high-voltage MOSFET) is designed for high-voltage, high-current applications such as motor drives, power conversion and power amplification. Genuine original stock; Rds(on), Vceo and package thermal performance are per the official Datasheet. Contact us for pricing, samples and available stock.
- Manufacturer
- lonten
- Part number
- LND25N50W
- Category
- High-Voltage MOSFETs
- Package
- TO-220F
- Condition
- New & Original
- Lifecycle
- Confirm with manufacturer
- Lead time / MOQ
- Confirm with quotation
Technical parameters
33 parametersConstruction
- ( TC = 100°C )
- 16 A
- Avalanche energy, single pulse 3)
- 1280 mJ
- Power Dissipation
- 40 W
- LND25N50W TO-220F
- 25N50W 50
- Input capacitance Ciss VDS = 25V, VGS = 0 V
- 4157
- Output capacitance Coss f = 250kHz
- 368 pF
- Reverse transfer capacitance Crss
- 16.4
- Turn-on delay time td(on) VDD = 400V, ID = 25A
- 43.2
- Rise time tr RG = 10Ω, VGS= 10V
- 76.6
- Turn-off delay time td(off)
- 85.6
- Fall time tf
- 15.5
- Gate to source charge Qgs VDD= 400V, ID=12.5A
- 17.8
- Gate to drain charge Qgd VGS=0 to 10V
- 22.3 nC
- Gate charge total Qg
- 74.2
- Reverse recovery time trr VR= 400V, IF= 25A
- 394.7 ns
- Reverse recovery charge Qrr dIF/dt=100 A/μs
- 5337 nC
Performance
- Drain-Source Voltage
- 500 V
- Continuous drain current 1) ( TC = 25°C )
- 25 A
- Gate-Source voltage
- ±30 V
- Operating and Storage Temperature Range TJ, TSTG -5
- 5 to +150 °C
- Continuous diode forward current
- 25 A
- Diode pulse current IS,pulse
- 100 A
- Thermal Resistance, Junction-to-Case RθJC
- 3.1 °C/W
- Thermal Resistance, Junction-to-Ambient RθJA
- 62 °C/W
- Soldering temperature, wave soldering only allowed Tsold
- 260 °C
- Drain-source breakdown voltage BVDSS VGS=0V, ID=0.25mA
- 500 V
- Gate threshold voltage VGS(th) VDS=VGS, ID=0.25mA
- 4.0 V
- Drain cut-off current IDSS VDS=500V, VGS=0 V,Tj = 25°C
- 1 μA
- Gate leakage current, Forward IGSSF VGS=20V, VDS=0V
- 100 nA
- Gate leakage current, Reverse IGSSR VGS=-20V, VDS=0V
- 100 nA
- Gate plateau voltage Vplateau
- 4.6 V
- Diode forward voltage VSD VGS= 0V, IF= 5A
- 1.3 V
- Peak reverse recovery current Irrm
- 21.46 A
Specifications & documentation
Use the official manufacturer documentation to verify electrical characteristics, package dimensions and operating limits before design approval.
Request confirmation of current stock, date code, packaging, price and delivery terms. Product information does not constitute a binding offer; final specifications are confirmed with your quotation.