Electronic component sourcing & distribution since 2004 richard@fastspeed-ic.com ↗
中文 Upload BOM Request quote
MAXIM / Wireless & RF

MAX2371ETC+

Analog / Mixed-Signal IC

New & Original Prototype to volume sourcing
COMPONENT PROFILE
MAXIMWireless & RF
MAX2371ETC+
Refer to manufacturer for product imagery
Package
TQFN-12-EP

Product overview

Analog / Mixed-Signal IC

Manufacturer
MAXIM
Part number
MAX2371ETC+
Category
Wireless & RF
Package
TQFN-12-EP
Condition
New & Original
Lifecycle
Confirm with manufacturer
Lead time / MOQ
Confirm with quotation

Technical parameters

33 parameters

Construction

RX_EN = low
3V
LNA_I = low
2.5
AGC Pin Impedance Pins
100
RX_EN = low, VCC = 3.3V
0.5 µA
Digital Input Logic Low VIL Pins LNA_I, RF_ATTN
0.3 ✕ V
Logic Pin Impedance Logic pins RX_EN, RF_ATTN
50 kΩ
Low band (MAX2371)
136
High band (MAX2373)
850
LNA_I = high;
1
Input Return Loss (S11) RF_ATTN = low
3
RF_ATTN = high
3
LNA_I = high, TA =
1
+25°C, VCC = 2.775V
3
LNA_I = low, TA =
1
VAGC = 1.275V
1.8
VAGC = 1.575V
5.0
RF_ATTN = low VAGC = 1.875V
11
SSB Noise Figure vs. AGC VAGC = 2.175V
20
+25°C, VCC = 2.775V, VAGC = 1.275V
2.1
RF_ATTN = low, LNA_I = high
19.5
VAGC < 1.8V LNA_I = low
24
RF_ATTN = high, LNA_I = high
3
LNA_I = high
5
Input IP3 (Notes 4, 5)
12
VAGC = VCC/2 to 1.80V
12.5
AGC Attenuation Range (Note 6)
35
RF_ATTN = low, VAGC = 1.625V
32
RF_ATTN = high, VAGC = 1.625V
24
RF_ATTN = high to low
16.0
RF_ATTN = low, LNA_I = high, MAX2371
8
VAGC = VCC/2 to 1.80V MAX2373
10.5

Performance

Supply Voltage
2.65
Supply Current ICC LNA_I = high, RF_ATTN = low
3.5 mA

Specifications & documentation

Use the official manufacturer documentation to verify electrical characteristics, package dimensions and operating limits before design approval.

Frequently asked questions

Common pre-quotation questions and selection notes to help you verify key parameters and sourcing before requesting a quote.

How do I verify the part is genuine / avoid counterfeit?

Buy only from authorized or franchised channels. On receipt, check: (1) laser-etched markings that solvent will not remove; (2) batch / lot code consistent between label and device; (3) original reel or tube packaging; (4) request traceability documents (CoC, date code). For critical parts, third-party X-ray / decapsulation testing is recommended.

How do I read the markings / date code on a chip?

Most active ICs use a 4-digit date code YYWW (year + week, e.g. 2345 = 2023 week 45). The top mark is manufacturer logo + base part number + lot code. For SMD code lookup, search by "marking code + package" on AllDataSheet / Octopart / LCSC.

What does the package code mean (TO-220, SOT-23, QFP…)?

Package codes describe the physical form factor and pin layout — critical when sourcing, because electrically equivalent parts in different packages will not fit the PCB. Common: TO-220 (3-terminal power), SOT-23 (3-pin small signal), DIP / SOIC (through-hole / SMD ICs), QFP / QFN (MCUs, processors).

What if my original model is discontinued (EOL / NRND)?

Three options: (1) the manufacturer’s recommended replacement; (2) franchised distributor legacy stock; (3) a functionally compatible cross-brand part — provided pinout and key parameters match. Always evaluate on a real board before mass swap.

What is the minimum order quantity (MOQ) and lead time?

We support both sample and volume orders. Minimum order quantity, stock availability and lead time are confirmed per inquiry — tell us your model and quantity and we will quote. Sample quantities for design validation are supported.

Can I get the datasheet and samples?

The full datasheet is linked on this page. For parts without a direct datasheet, we can locate the manufacturer document on request. Sample requests are supported — contact us with your model and quantity.

Request confirmation of current stock, date code, packaging, price and delivery terms. Product information does not constitute a binding offer; final specifications are confirmed with your quotation.